PMTC is a professional solder ball manufacturer with over two decades of experience in semiconductor IC packaging materials.

We have always been committed to the development, manufacturing, and sales of solder products for electronic assembly. Our products are widely utilized in advanced IC packaging processes, including BGA, CSP, WL CSP, and are highly regarded by major packaging facilities and IC design companies worldwide.

Dary Technology embraces innovation and a customer-centric approach. We have collaborated extensively with IC design companies and IC packaging facilities to jointly develop solder products of high reliability, positioning ourselves at the forefront of the industry.

We also extend our technical services by conducting Failure Analysis (FA) directly for IC design companies and IC packaging facilities, working closely with clients to solve problems and meet their specific needs.

With a philosophy of integrity and honesty, Dary Technology is dedicated to providing comprehensive solutions and is gradually expanding its presence in the packaging materials market.

•Established on year 2004.

•Obtained ISO14001 environmental management system certification.

•Obtained ISO9001 quality management system & TS16949 automotive industry quality certification.

•Signed a patent authorization for tin-silver-copper series lead-free alloys with Japan’s Fuji Electric Company.

•Appointed professors from the Materials Research Institute of a well-known national university in Taiwan as technical consultants.

•Certified VDA6.3 process audit.
•Accepted the commission of a third party to conduct an Electronic Industry Code of Conduct audit (EICC, now renamed RBA).

•Obtained the revised IATF16949 automotive quality certification.

•Scored No.1 solder ball supplier of SPIL

•Scored No.1 solder ball supplier of SPIL

•Monthly sale volume up to 187,000KK.

•Monthly sale volume up to 200,000KK.