Solder Balls

It is the third generation (Area Array)IC packaging technology, in which many solder balls are arranged in an array at the bottom of the die, and the traditional way of using metal lead frames as pins is replaced by solder balls. The advantage of this packaging technology is that the number of pins can be increased under the same size and area, and its packaging area and weight are only half that of QFP, and high-quality BGA solder balls of 0.76mm~ 0.10mm can be manufactured, which is suitable for the production of BGA, CSP, WLCSP and Flip Chip in packaging industry.

Product Advantages

●Various series of alloys are available, which can correspond to the customer’s material selection for various applications.

●Having the ability to configure alloys, based on various customer requirements, PMTC can cooperate with customers to improve and enhance product properties or develop new products.

●Advanced solder ball spray forming process to achieve high roundness and fine tolerance of tin balls.

●Using high-precision screening technology to maintain the accuracy of ball diamete.

Alloy Composition

If the customers have special alloy specifications, PMTC can cooperate with them to developed customer’s special needs.
The ingredients of this product fully comply with the specific hazardous substance control requirements of RoHS.

 

Low Alpha Solder balls

Note: For general Alpha solder products, Alpha≧0.05 CPH/cm2, such as SAC305 solder = 1.242 CPH/cm2

Diameter & Tolerance

If the customers have special specifications and tolerances, PMTC can develop it according to the customer’s special needs.